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What is the difference between CSP and BGA?
Package Type Definitions In this article, BGA refers to a 35-mm or larger device with 760-µm solder balls. The term CSP describes devices with 250-µm solder balls and an interposer layer between the die and solder balls. The overall package size of a CSP is typically no larger than 1.2 times the size of the silicon.
What is CSP BGA?
(Chip Scale Packaging Ball Grid Array) A BGA chip package that is not much larger than the chip itself. See MicroBGA, BGA and CSP.
Is Flip Chip a BGA?
A flip chip BGA is a specific type of ball grid array that makes use of a controlled collapse chip connection, or flip-chip. It works though solder bumps on the top of the chip pads. The process starts with integrated circuits on the wafer. Pads are metallized on the chips and solder balls are placed on each pad.
What is qualification testing?
The evaluation of a product (new, existing, or modified) to determine its acceptability for a given job or function or to determine if it conforms to requirements of an applicable specification.
How do you qualify a product?
Product qualification is to evaluate the product based on the physical testing on the manufactured prototype. The purpose is to verify whether the product has met or exceeded its intended quality and reliability requirements. After virtual and product qualification, the products are mass produced.
What is the typical packaging efficiency of CSP?
In the past, CSP’s have been defined as a package that is 1.2X the size of the die. However, some types of CSPs maintain their package size as the internal silicon die reduces in size as a result of the fabrication lithography process gets smaller (die shrink).
What is product qualification testing?
What is ATP and QTP?
For example, with mechanical Q&A testing of satellites, standard qualification test procedures (QTP) are usually different from standard acceptance test procedures (ATP). The QTP is more comprehensive and is performed at higher levels on engineering models to qualify mechanical designs.
What is a qualification test?
What is lead qualification?
Lead qualification is the process businesses use to determine which prospects are the best sales targets. Not everyone who expresses interest in a product or service is ready to make a purchase. That’s why lead qualification is a critical part of any sales strategy.
What is BGA in laptop?
(Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used.
What is FC CSP?
FC-CSP(Flip Chip-CSP) means that the chip mounted in the PCB is turned over. Compared to the general CSP, the difference is that the connection between the semiconductor chip and the substrate is not wire bonding, but bumps.
What is the difference between CSP and BGA package?
Answer: CSP is only smaller in size, smaller than CSP is called FC (Flip Chip). Flip Chip is called flip chip in our SMT assembly, which is to solder the bare chip directly to the PCB. Generally less than 1: 1.2 CSP pitch <0.8 mm? In summary, BGA package and CSP package have their own different advantages and disadvantages.
What are the qualification requirements for BGA plastic packaging?
zReview Qualification Data by Vendor Most plastic BGAs on polymeric boards have sufficient life cycle to meet the A and B NASA requirements Plastic package with large die may be required to qualify for B Low I/O ceramic sufficient life for A High I/O may not meet either B or even A mission categories
What are Chip Scale Packages (CSP)?
Already chip scale packages (CSPs) are making their appearance. Unlike conventional BGA technology at typically 1.27 mm (0.050’’) pitch, CSPs utilize lower pitches, e.g. currently 0.8 to 0.4 mm, and hence, will have smaller sizes and their own challenges. CSPs are competing with bare die assemblies.
What is the difference between ceramic BGA and flip chip BGA?
The ceramic BGA package uses a higher melting ball (90Pb/10Sn) with eutectic attachment to the die and board. Column grid array (CGA or CCGA) is similar to BGA except it uses column interconnects instead of balls. Flip chip BGA (FCBGA) is similar to BGA, except it is internal to the package and flip chip die is used.