Table of Contents
How are QFN packages made?
The QFN packages come with a die that is surrounded by a lead frame. The lead frame is made up of a copper alloy with a matt tin coating. The die and the frame are usually connected to each other using wire bonding. Copper/gold is usually preferred for wire bonding.
What is difference between QFN and DFN?
The DFN/QFN is a surface mount plastic package with leads located at the bottom of the package, with the DFN having leads on two sides of the package versus on four sides for the QFN.
What is a son package?
Small Outline No Lead (SON) packages provide a small form factor at 0.4 and 0.5mm pitch. These are normally smaller pincount devices in a robust, plastic package compatible with all end equipment including automotive.
What is Wlcsp package?
Freescale Semiconductor, Inc. 3 Wafer Level Chip Scale Package (WLCSP) 3.1. Package Description. Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from a wafer.
What is the difference between LQFP and TQFP?
LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package named Low profile Quad Flat Package. TQFP package having total height less than 1.2mm, said package named Thin profile Quad Flat Package.
Is Wlcsp flip chip?
The wafer level chip scale package (WLCSP) is a variant of the flip-chip interconnection technique where all packaging is done at the wafer level. With WLCSPs, the active side of the die is inverted and connected to the printed circuit board (PCB) using solder balls.
How do I solder TQFP package?
Put a small amount of solder on the tip of the solder iron. While holding down the aligned QFP with a pick or other pointed tool, add a small amount of solder flux to the corner leads in two opposite corners. While still holding the part down with the pick, solder down two opposite corner leads on the QFP.
What are BGA made of?
What is a BGA? A Ball Grid Array Integrated Circuit is a surface mount device (SMD) component that possesses no leads. This SMD package employs an array of metal spheres that are made of solder called the solder balls for connections to the PCB (Printed Circuit Board).